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Students from the School of Integrated Circuits Win First Prize at the National Finals of the National College Students’ Embedded Chip and System Design Competition

Date: Aug 13, 2026

On August 13, the National Finals of the 9thNational College Students’ Embedded Chip and System Design Competition (2026) concluded successfully in Nanjing. In the Chip Application Track, the “Starlight Odyssey” team, comprising Chen Xiaonan, Li Yan, and Xie Haixia, students in the Electronic Information Engineering Technology program of the School of Integrated Circuits, delivered an outstanding performance with their project,namely“Smart Wearable System for Campus Physical Fitness Testing.” The team won First Prize in the National Finals and also received the “iSoftStone Cup” Special Enterprise Award, a prestigious enterprise award presented to only two teams nationwide.

Designed for large-scale on-campus physical fitness testing, the project uses a RISC-V-based main control chip and the OpenHarmony technology ecosystem to develop edge devices. With NearLink communication and a HarmonyOS mobile application, the system enables data collection, transmission, visualization, and management. During the prototype development stage, the team completed the design of a wearable PCB prototype and system integration testing, achieving a closed loop from data collection and edge-side processing to wireless transmission and mobile-side management. The project demonstrated strong engineering practice and system integration capabilities.

This year’s Chip Application Track reached a new record in scale, featuring 19 enterprise-sponsored competition categories and attracting more than 17,000 teams from 908 universities across China. The competition featured preliminary and offline semifinal rounds across six regional divisions. Following multiple rounds of selection, 1,227 outstanding teams advanced to the National Finals in Nanjing. The National Finals featured multiple components, including competency assessment, project showcase, live demonstration,as well asproject defense and discussion, providing a comprehensive evaluation of the participating students’ professional knowledge, engineering practice skills, system design capabilities, and capacity for innovative application.

This award demonstrates the comprehensive capabilities of students from the School of Integrated Circuits in embedded system design, the application of domestic hardware and software ecosystems, engineering practice, and innovative application. Going forward, the School will continue to leverage high-level academic competitions as a driver, deepen industry-education integration, encourage students to conduct innovative practical projects addressing industry needs and real-world engineering challenges, and continuously improve the quality of training for highly skilled technical professionals.

(Yang Lihua, School of Integrated Circuits)

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